CALL FOR PAPER.

The 5th Asian Symposium on Material and Processing 2018
Date: December 7-8, 2018
Venue: Swissôtel Le Concorde, Bangkok, Thailand

Announcements

  • Deadline for Abstract submission Extended to : June 30th, 2018

Scope

This is the 5th in the series of ASMP (past symposiums were held in Bangkok, Thailand (1st), in Penang, Malaysia (2nd) and in Chennai, India (3rd), in Lombok, Indonesia (4th)). The aim of the symposium is to enhance mutual collaboration for higher research level and activity in the fields of Materials and Processing Engineering in Asian region. The symposium will become a perfect platform to share, discuss and exchange ideas on the latest development and recent findings in research studies related to advanced materials and processing among international participants. We would like to cordially invite you to ASMP2018!

Sessions for oral and poster presentations

  • Advanced Materials 
  • Metals, Ceramics, Polymers and Composites 
  • Smart Materials and Structures, Functional Materials
  • Materials Processing, Forming, Casting and Machining
  • Powder Metallurgy, Adhesion and Interface, Welding and Bonding
  • Nanofabrication and Nano / Micro / Meso Manufacturing Processes
  • Advanced Manufacturing
  • Micro and Nano Technology in Materials and Processing
  • Mechanical Properties, Fracture and Reliability
  • Dynamic Behavior of Materials and Structures
  • Materials Characterization and Measurement Techniques
  • Non-Destructive Testing and Evaluations, Monitoring and Sensing Technology /Modeling, Analysis and Simulation in Materials and Processing 

Abstract/ extended abstract

  1. Authors should submit an abstract NOT exceeding 300 words, no later than June 30th, 2018 by e-mail to secretary.asmp2018@gmail.com including 1) Paper title, 2) Authors’ names, 3) Affiliation, 4) Job title, 5) Mailing address, 6) Phone and fax, 7) E-mail address, and 8) Five key words. Format of abstract can be downloaded from the conference website.
  2. Conference proceedings will be published by JSME. Authors should submit the proceeding paper (2 pages including figures), no later than July 30th, 2018, through the conference website. After reviewing process by the conference committee, authors will be notified of acceptance or modification of their papers. Accepted papers will appear on the ASMP2018 Conference Proceeding.

Special Issue in Mechanical Engineering Journal (JSME) 

Selected proceeding are recommended to submit papers to the Special Issue on the Asian Symposium on Materials and Processing (ASMP2018) of Mechanical Engineering Journal. After regular peer reviewing process, the special issue.   

Registration Fee

Types of participants Early-bird registration Late registration
Japanese participant JPY 50,000 JPY 55,000
Oversea participants USD 450 USD 500
Thailand participants THB 10,000 THB 12,000
Japanese student JPY 40,000 JPY 45,000
Oversea student USD 350 USD 400
Thailand student THB 6,000 THB 7,000

Payment Method

Participants from Thailand
Bank transfers should be made to the saving account below. A copy of the receipt of the bank remittance should be sent to conference secretariat by e-mail: ragkiat.niy@mtec.or.th
Account Name: National Metal and Materials Technology Center
Account Number: 080-0-000846
Bank Name: BANGKOK BANK PLC.
Swift Code: BKKBTHBK 

Participants from Japan or Oversea contries
To be announced.


Important Date

  • Deadline for Abstract submission : June 30th, 2018
  • Notification Abstract acceptance : June 30th, 2018
  • Start Early Registration : May 31st, 2018
  • Deadline for submission of Extended Abstract (2page) : July 30th, 2018
  • Deadline for submission of Poster presentation : July 30th, 2018
  • Deadline for early-bird registration : August 31st, 2018
  • Deadline for late registration : September 30th, 2018.
  • ASMP2018 : Dec. 7th - 8th , 2018
  • Full Paper Submission Deadline : To be announced.

Committee

Program

To be Announced.

Keynote lectures

To be Announced.

Contact

Conference Secretariat

Thailand
Mr. Ragkiat Niyomvanicha
MTEC, Thailand
Email: ragkiat.niy@mtec.or.th

International
Assoc. Prof. Yuichi Otsuka
Nagaoka University of Technology, Japan
Email:secretary.asmp2018@gmail.com  

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